Japan, Sept. 9 -- SCREEN HOLDINGS CO LTD has got intellectual property rights for 'SUBSTRATE PROCESSING DEVICE AND MONITORING METHOD IN THE SAME.' Other related details are as follows: Application Nu... Read More
Japan, Sept. 9 -- SUMITOMO WIRING SYST LTD has got intellectual property rights for 'RELAY CONNECTOR.' Other related details are as follows: Application Number: JP,2022-179589 Category (FI): H01R13/... Read More
Japan, Sept. 9 -- FUJI ELECTRIC CO LTD has got intellectual property rights for 'SEMICONDUCTOR DEVICE.' Other related details are as follows: Application Number: JP,2022-025063 Category (FI): H03F3/... Read More
Japan, Sept. 9 -- SANKYO CO LTD has got intellectual property rights for 'GAME MACHINE.' Other related details are as follows: Application Number: JP,2022-022915 Category (FI): A63F7/02,320 Stage: ... Read More
Japan, Sept. 9 -- SANKYO CO LTD has got intellectual property rights for 'GAME MACHINE.' Other related details are as follows: Application Number: JP,2022-022914 Category (FI): A63F7/02,320 Stage: ... Read More
Japan, Sept. 9 -- SANKYO CO LTD has got intellectual property rights for 'GAME MACHINE.' Other related details are as follows: Application Number: JP,2022-022913 Category (FI): A63F7/02,320 Stage: ... Read More
Japan, Sept. 9 -- TOKYO ELECTRON LTD has got intellectual property rights for 'SUBSTRATE PROCESSING APPARATUS.' Other related details are as follows: Application Number: JP,2022-183839 Category (FI)... Read More
Japan, Sept. 9 -- FUJI ELECTRIC CO LTD has got intellectual property rights for 'GAS CIRCUIT BREAKER.' Other related details are as follows: Application Number: JP,2022-017743 Category (FI): H01H33/... Read More
Japan, Sept. 9 -- EBARA CORP has got intellectual property rights for 'MOTOR PUMP AND MOTOR PUMP ASSEMBLY.' Other related details are as follows: Application Number: JP,2022-016995 Category (FI): F0... Read More
Japan, Sept. 9 -- TEIJIN LTD has got intellectual property rights for 'THERMOPLASTIC RESIN COMPOSITION AND MOLDING OF THE SAME.' Other related details are as follows: Application Number: JP,2022-0160... Read More